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Phoenix V|tome|x C450

Inspect and measure large samples with high precision and throughout. 

The V|tome|x C450 is also available with Mesofocus tube for more resolution. The Phoenix V|tome|x C is a high performance compact industrial 450 kV Minifocus CT system for inspection and 3D metrology of a wide applications range such as large light metal castings, turbine blades, AM parts etc. 

Waygate Technologies’ patented Scatter|correct technology automatically removes most scatter artifacts from the CT volume. This technological advancement provides image quality like that achieved with conventional fan-beam scanning but at speeds up to 100 times faster.

 



Industrial CT Inspection of large, high absorbing samples starts here

Our Phoenix V|tome|x C is a compact 450 kV CT system with the largest possible scan volume and usable specimen weight especially for production and production-related areas such as production lines and quality assurance laboratories in battery manufacturing, in foundries and in aerospace – a flexible combination of semi-automated, non-destructive inspection and VDI 2630-1.3 specified 3D metrology.

The Phoenix V|tome|x C comes standard with our exclusive 4 MP Dynamic 41|200 next-generation photodiode design industrial X-ray detector. It provides 10x increased sensitivity relative to the state of the art 200 µm pixel size DXR detectors producing 2-3x cycle time increase without image quality impact, making inspections and measurements more efficient and productive. Compared to 16-bit detectors, the optimized 14-bit technology offers the highest efficiency with a dynamic range of 10000:1 and thus saves time in use and also generates less noise in the image. As a premium option, the 100 µm / 16 MP Dynamic 41|100 detector provides a 2x resolution increase without cycle time impact. Detection of 2x smaller defects without an increase of geometric magnification allows for the imaging of large objects at a higher resolution.



Product Highlights

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  • Inspection volume up to Ø 500 mm x 1000 mm

  • Granite-based manipulator for parts up to 100 kg

  • Best detail recognition ~100 μm with Minifocus tube and depending on the application even better with Mesofocus

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  • Metrology|edition for clearly defined metrology specification of SD ≤ (15 ± L/50 mm) µm (according to VDI/VDE 2630-1.3)

  • Unique detector technology for 2-3 times higher CT inspection speed

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  • Patented Scatter|correct technology for minimized artifacts and up to 100 times faster precision scans

  • Exclusive Flash!TM image optimization technology



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  • Flash!TM

  • Optional automatic defect detection (ADR)

  • CT performance specified according to ASTM E 1695 guideline

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  • 450 kV / 1500 W bipolar Minifocus or the optional Mesofocus X-ray tube for higher resolution – specially optimized for CT applications
  • Special design for sharp CT scans of large and high absorbing samples




Benefits

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  • Offers industry-leading specimen weight, flexibility and maximum penetration power for highly absorbent parts at 450 kV

  • Delivers extremely high-quality cone beam CT with minimal scattering artifacts

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  • High level of automation minimizes the time and effort required by the operator

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  • Increased repeatability and reproducibility of CT results

  • Easier to operate than ever before thanks to easy loading tools and automation features

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  • Metrology|edition for precision measurements of internal surfaces and structures



Product Specifications

Details

Data

Minifocus X-ray tube

Closed ISOVOLT 450 M2/0.4-1.0HP (optional 450 kV Mesofocus for non HS or Metrology|edition)                

Max. voltage / power

450 kV @ 700 W/1,500 W

Focal spot

0.4 mm (max. power 700 W) / 1.0 mm (max. power 1,500 W)

Focus Detector Distance (FDD)

1,300 mm

Voxelsize range

100-146 µm

Geometrical magnification (3D)

1.37-2x

Spatial CT resolution

2.5lp/mm at 130µm voxel resolution referring to ASTM E1695

Detail detectability

Down to ~100 µm

Max. 3D scan area d x h / max. weight

500 x 1,000 mm (270 x 1,000 mm Scatter|correct) / up to 50 kg (110 lbs.) or optionally up to 100 kg (220 lbs.)

 



Innovative Technologies & Components
Scatter|correct technology

Achieve unprecedented low-artifact precision that is up to 100 times faster than a comparable high-quality fan beam CT.

Dynamic 41 detector technology

Twice the CT resolution at the same speed and twice the throughput with the same quality as 200 µm DXR detectors. The optimized 14-bit technology offers the highest efficiency compared to 16-bit detectors with a dynamic range of 10000:1, thus saving time in use and also generating less image noise.

Helix|CT

Scan with improved image quality to increase the probability of detection (POD) efficiently and easily.

Offset|CT

Scan even large parts with up to 70 % larger scan volumes.

Orbit|scan

Virtual scan rotation axis for easy scan adjustment and flexible ROI CT scans.

Multi|bhc

The Multi|bhc tool corrects beam hardening artifacts, which typically appear as dark stripes between dense areas in multi-material samples.

One-button|CT automation

Scan at the touch of a button to achieve high throughput and efficiency.

Quick-pick|Manipulator

The Quick-pick|Manipulator of the high-speed configuration HS even enables fully automated CT evaluation of large series, e.g. scanning of up to 25 turbine blades without personnel within approx. 2 hours. The system offers industry-leading sample size, flexibility and maximum penetration performance for highly absorbent samples at 450 kV.

3D Speed|ADR

In-house speed-optimized 3D volume analysis and defect detection for process control in industrial mass production.

Metrology|edition

The system guarantees a measurement accuracy of SD ≤ (15 ± L/50 mm) µm in accordance with VDI/VDE 2630-1.3 for reliable revalidation of system performance and reproducible measurement applications. The Ruby|plate 240 calibration module and the compensation of thermal drift effects through the use of temperature sensors enable automated measurement sequences and precision at a new performance level for even larger parts.

This enables the improved VDI 2630-compliant accuracy specification and three times faster performance verification of multiple positions - reliably and reproducibly:

CAD target/actual comparison

Dimensional measurements / wall thickness analysis

Reverse engineering / tool compensation



FAQs
What software is available for the V|tome|x C?

Phoenix Datos|x 3D computed tomography acquisition and reconstruction software. Optional 3D evaluation softwarepackages available upon request for 3D metrology, failure analysis, and structural analysis with lowest scatter artifacts.

Does the system allow automated batch CT?

Yes, the Quick|pick manipulator of the high-speed configuration HS allows fully automated CT evaluation of large batches, e.g. to scan up to 25 turbine blades without any operator action within approx. 2 hrs.

What type of detector does the V|tome|x C use?

The V|tome|x C from Waygate Technologies uses a temperature-stabilized Dynamic 41|200p+ large area detector with superior image and result quality, 410 x 410 mm (16” x 16”), 200 µm pixel size, 2036 x 2036 pixels (4 MP), extremely high dynamic range > 10000:1.  

Alternatively the Dynamic 41|100 with the same size and dynamic range but with 100 µm pixel size resulting in 16 MP can be used. 

If necessary optionally detectors a LDA detector package („fan”: 16 bit Linear Detector Array with 820 mm sensitive width, 2050 pixels, 400 µm pitch) is available also in combination with a Dynamic 41 detector.

What is the maximum part dimension and weight I can inspect?

Scans are possible up to a sample dimension of Ø 500 mm x 1000 mm (max. scan diameter ~500 mm) and 100 kg (for HS version: 270 x 310 mm / up to 10 kg rotation unit and  100 x 125 mm / up to 3 kg Quick|pick gripper), depending on the application.

What type of radiation safety does the V|tome|x C have?

The V|tome|x C employs a radiation safety cabinet for full protective installation without type approval according to German StrSchV/StrSchG and in compliance with French NFC 74 100 and US Performance Standard 21 CFR Subchapter J. For operation, other official licenses may be necessary.



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