Phoenix Microme|x Neo & Nanome|x Neo

Compared to conventional beryllium targets, the Diamond|window allows higher power at a smaller focal spot. This ensures high-resolution
even at high output.

• Up to 2 times faster CT data acquisition at the same high image quality level
• High output with high-resolution
• Non-toxic target
• Improved focal spot position stability within long term measurements
• Increased target lifetime due to less degradation with higher power density

For advanced inspection and 3D analysis of smaller samples, Phoenix|x-ray’s proprietary 3D CT technology is optionally available.

• 180 kV / 20 W high power X-ray technology, fast image acquisition with DXR detector and Diamond|window combined with Phoenix|x-ray’s fast reconstruction software deliver high-quality inspection results
• Maximum voxel resolution down to 2 microns; the nanoCT^® capability of the Nanome|x Neo allows higher image sharpness
• The mechanical precision of the CT rotation units are optimized for highest resolution CT applications

X|act provides not only a minimal setup time compared to conventional view based AXI – once programmed, the inspection program is portable to all X|act compatible systems. The result is fast and easy programming: just assign the inspection strategies and let X|act generate the automated inspection program

• Specific inspection strategies for different pad types
• Fully automated inspection program generation
• Outstanding precision and repeatability - resolutions of only a few micrometers, 360° rotation, and oblique viewing up to 70°
• High reproducibility on large PCBs
• Easy pad identification by its live CAD data overlay function coupled with FLASH!™ image optimization

Planar|CT slice or multislice views allow exact inspection results of a single plane or a whole package. 

• Easy 2D slice or 3D volume evaluation of large complex boards
• No board cutting, no overlaying structures as in X-ray images
• New designed workflow, minimize the scan preparation and human interaction with no loss of image quality.
• User friendly, less product knowledge required to complete a planar CT inspection

• Brilliant live inspection images with high dynamic Waygate Technologies DXR digital detector array
• Large 27” monitor and ultra-high defect coverage and repeatability
• Detail detectability at 0.5 µm or 0.2 µm with nanofocus
• Live overlay of CAD and inspection results even in rotated oblique inspection views
• High power 180 kV / 20 W microfocus or nanofocus tube for high absorbing electronic samples

Clear overview and fast positioning: 

• Optical camera image or X-ray overview image for whole sample as navigation map
• Fast manipulation by clicking on the map
• Inspection program can be set based on the optical navigation map
• Position on the map can be saved into test report generated by X|act

Waygate Technologies´ proprietary Shadow|target inside the X-ray tube enables a reduction of unnecessary radiation dose compared to conventional x-ray tubes during a typical inspection. Combined in a low-dose bundle together with the brand new Dose|manager tool, it enables real-time dose monitoring and controlling

This solution protects radiation sensitive inspected components from aging to worst case damage.

• Shadow|target reduces unwanted radiation without frequent generator start & stop
• Fast and stable X-ray recovering. No delay of energy running up
• Realtime visualization of projected dose through “dose map”  overlaid with Navigation map
• Cumulated dose calculation per inspection
• Multi-position dose measurement well integrated into inspection program
• Comparing with manual inspection, up to 99% radiation dose can be saved combining dose control technologies with automated inspection (programming)

• Minimized setup time due to highly efficient automated CAD programming
• Designed for portability with compact, state-of-the-art electronics
• Intuitive GUI interface with fully automated inspection program generation

• Optional Flash!Electronics™ image processing technology
• Optional advanced failure analysis with high-resolution 3D micro- or nanoCT^® or large board PlanarCT
• Optional 3D CT scans up to 10 seconds

Microme|x Neo offers either a 160KV micro focus tube or a 180KV micro focus tube while Nanome|x Neo is equipped with a 180KV nano focus tube. The diamond window is installed as standard. Detail detectability at 0.5 µm (Microme|x Neo) or 0.2 µm (Nanome|x Neo). 20W power on target for all tube fleet contributes to high inspection resolution and throughput.

Microme|x Neo and Nanome|x Neo offer various detectors with unique features fulfilling your particular application,

• 75 µm resolution DXR S85 detector of best performance-price ratio for small components and PCB/PCBA inspection
• 200 µm resolution DXR 250RT with active cooling of extremely high dynamic range and brilliant image quality ensuring fast and detailed live inspection
• 139 µm resolution DXR S140 with super fast imaging meeting comprehensive needs of high integrated micro electronics inspection
• 100 µm resolution large size DXR S100 Pro detector offering outstanding combination of detectability and productivity, perfectly fitting semiconductor and large sample inspection

The Max. inspection area of our system is 460 mm x 360 mm (18” x 14”) with a rotation table, and 610 mm x 510 mm (24” x 20”) with an optional X-Y table (non-rotatable). Max. sample size/weight is 680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.).

Microme|x Neo and Nanome|x Neo is equipped with high-precision 5-axis manipulator platforms - X, Y, Z, tilt and rotate axis.

Open tube technology provides an X-ray tube with unlimited lifetime. The tube can be quickly restored to optimal performance by replacing the filament. The plug-in cathode used by Microme|x Neo and Nanome|x Neo has an integrated filament, which allows customers to replace it quickly and easily, minimizing system down time.

Phoenix|x-ray’s proprietary 3D CT technology is optionally available on the Microme|x Neo and Nanome|x Neo for advanced inspection and 3D analysis of smaller samples. Max. geometric magnification could be 100x (CT) and Max. voxel resolution down to 2um, resolution depending on the sample size.

Easyfix|CT, 3D cone beam CT, can deal with all the small samples. When the sample is too large to be rotated, Planar|CT can be used for 3D imaging avoiding sample cutting.

Some radiation sensitive electronics such as memory and resistor will get damaged by certain dose. Therefore, the radiation dose needs to be strictly monitored and managed for reducing the quality (inspection) cost as much as possible. Waygate Technologies’ low dose management bundle is a comprehensive solution which combines Shadow|target and Dose|manager enabling dose control from both source end and receptor end.

Dose control is well integrated with inspection programming and fitting various applications.

Absolutely yes. The X|act software on the Microme|x Neo and Nanome|x Neo provides various levels of automated inspection procedures

• View based and CAD based programmable and intelligent process with automated image processing.

• Wizard guided solder joint modules for easy setup of e.g. voiding calculation or BGA inspection tasks.

• Image processing toolkit “Xe²”, extremely powerful evaluate tool that can be programmed by users with human logic language and adapted for the X-ray inspection process of various application.

• OPC-UA based software communication protocol to enable integration with automation subsystems such as sample loader (not standard in X|act)

Microme|x Neo and Nanome|x Neo uses proprietary OVHM technology to achieve tilt view. And they are the only systems on the market that places the tube above the sample and the FPD below the sample. The unique benefit is:

• Operator sees the sample exactly as it appears in the X-ray image (intuitive inspection)

• Tube can be as close as possible to the sample to achieve highest magnification.

• Precision manipulator locks field of view during rotation and OVHM tilt